The invention can prevent the headphone lead wire from knotting up for protection and prolong the service life. 本发明可防止耳机引线打结,保护耳机引线,延长使用寿命。
Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。