Test specification Test name DROP TEST FOR UNPACKED APPARATUS Evaluate the shock resistance of an apparatus unpacked to resist a series of drop tests. 评估无包装的仪器的耐震强度来进行一系列下落测试。
Superior solderability and resistance to soldering heat. 优良的可焊性及耐热冲击性。
However, impact resistance follows no discernable rules. 但是,耐冲击性还没有可以遵循的法则。